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As integrated circuits and their components continue to scale downward, the dimensions of metal interconnects and contacts between...
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The ALTA 4700DP system provides cost-effective patterning of binary masks and phase shifting masks (PSM), supporting fast turnaround and...
The best-in-class Applied Axcela PVD system has demonstrated process superiority and stability with non-uniformities of <2% 1σ over...
The Applied Aera 4 Mask Inspection system is a fourth-generation 193nm-based inspection tool unique in combining true aerial imaging...
The Applied Aeris-G system is a pre-pump plasma abatement solution that uses less energy by treating the actual process gas volume—a...
Designed to treat the “dirtiest” applications, the Aeris-S operates by converting problematic materials into compounds that can be...
Aeris-Si is an integrated solution for subfab foreline cleaning to manage silica load and improve pump lifetime. The solution enables a...
Ginestra? is a software product designed to simulate the operation and electrical characteristics of modern logic (e.g., FinFET, FeFET)...
Today’s global digital transformation is driving the need for lower-cost, higher-density DRAM chips, particularly for data center...
Achieving world class photomask CD uniformity begins with the quality of resist coating. At the nanometer scale many subtle factors...
Cleaning methods for photomasks used in 193i and EUV lithography are driven by sensitive mask materials and the environments in which...
The use of chemically amplified resists for photomask manufacturing requires tight control of the post exposure bake (PEB) step, which...
Accurate development of the exposed resist pattern is essential to preserving the inherent CD uniformity of a photomask that has gone...
As semiconductor scaling has continued, increasingly rigorous requirements for precision and uniformity in chip fabrication have...
Semiconductor scaling continues steadily into the single-digit nodes, setting increasingly demanding requirements for precision and...
The Centura DPN HD (high dose) system consists of decoupled plasma nitridation (DPN) and post-nitridation anneal (PNA) chambers...
Applications in the advanced CMOS and MtM segments are driving the need for advanced 150mm and 200mm CVD technology. Ultra-thick oxides...
Responding to evolving power and MEMS device requirements, device manufacturers are targeting thicker epitaxial layers. Film thicknesses...
Applied Materials Centura Etch system delivers high-productivity silicon, metal, and dielectric etch. Etching is one of the most...
Leveraging Applied’s epitaxy expertise gained with the industry-leading Centura RP Epi system over almost two decades, the Centura Prime...
TSV offers product designers a new and highly space-efficient degree of freedom by enabling integration of circuit components from...
Extreme ultraviolet (EUV) photomasks are used for transferring circuitry patterns onto wafers with new lithography systems using high-...
The Applied Centura Tetra Z Photomask Etch system delivers state-of-the-art performance required to etch optical lithography photomasks...
The Applied Centura Ultima HDP CVD 200mm and 300mm systems deliver a high-density plasma CVD process. It has been the industry-leading...